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Kulicke & Soffa Industries > Subsidiaries

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Directory > Business and Economy > Business to Business > Electronics > Circuit Boards > Manufacturing Equipment > Makers > Kulicke & Soffa Industries > Subsidiaries


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  • Flip Chip Technologies
    Offers wafer bumping services, wafer-level chip-scale packaging, redistribution of peripheral pads, test die and substrates, solder alloys, technology licensing, and more.
    www.flipchip.com
 



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