- ASE Group@
dir.yahoo.com/.../Manufacturing_Process/ASE_Group
- BALL Semiconductor, Inc.
Emerging semiconductor manufacturing technology and a new class of semiconductor products.
www.ballsemi.com
- Conexant Systems
(Nasdaq:CNXT)
Development and manufacturing of system-level semiconductor solutions that use mixed-signal processing technology.
www.conexant.com
- DISCO Corporation
Provider of dicing, grinding, and polishing solutions for the semiconductor industry. Disco Corporation uses precision machines and processing tools like blades and wheels to manufacture products for various applications.
www.discousa.com
- Grinding and Dicing Services, Inc.
Offers wafer grinding, polishing, dicing, waffle packs, die inspection, tape and reel, grinding tapes, dicing tapes, and wafer boxes.
www.wafergrind.com
- HGM, Inc.
Marking and demarking of semiconductor packages.
www.hgminc.com
- IDS Electronics
Semiconductor contract assembly and test foundry.
www.idsesb.com.my
- MicroWave Technology
Manufacturer of amplifiers and GaAS FETs for the transmission and reception of information in semiconductors.
www.mwtinc.com
- Mintech Semiconductors Ltd
Approved die assessor offering unencapsulated semiconductor die in wafer form, custom packaging of die, and electrical testing.
www.mintech.co.uk
- Prime Solutions
Offers laser marking, demarking, surface reconditioning, plasma cleaning, and other related services.
www.primesol.com
- RF Micro Devices
(Nasdaq:RFMD)
Manufactures a variety of amplifiers, attenuators, mixers, modulators, transceivers, and other components for wireless communications devices.
www.rfmd.com
- Solecon Laboratories, Inc.
Spreading resistance and 4 point probe testing laboratories for use by the silicon and germanium semiconductor wafer fabs.
www.solecon.com
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